[News] Samsung Establishes New HBM Team to Advance HBM3, HBM3e and HBM4 Development

2024-07-05 Semiconductors editor

In order to address the growing demand for high-performance memory solutions fueled by the expansion of the artificial intelligence (AI) market, Samsung Electronics has formed a new “HBM Development Team” within its Device Solutions (DS) Division to enhance its competitive edge in high-bandwidth memory (HBM), according to the latest report from Business Korea. The new team will concentrate on advancing the progress on HBM3, HBM3e, and the next-generation HBM4 technologies, the report noted.

This initiative comes shortly after the Korean memory giant changed its semiconductor business leader in May. Citing industry sources, the report stated that Samsung’s DS Division carried out an organizational restructuring centered on the establishment of the HBM Development Team.

Also, the move attracts attention as on July 4th, a report from Korea media outlet Newdaily indicated that Samsung has finally obtained approval from NVIDIA for qualification of its 5th generation HBM, HBM3e, though the company denied the market rumor afterwards.

Samsung has a long history of dedicating to HBM development. Since 2015, it has maintained an HBM development organization within its Memory Business Division. Earlier this year, the tech heavyweight also created a task force (TF) to boost its HBM competitiveness, and the new team will unify and enhance these ongoing efforts, the report noted.

According to the report, Samsung reached a significant milestone in February by developing the industry’s first HBM3e 12-layer stack, which offers the industry’s largest capacity of 36 gigabytes (GB). Samples of the HBM3e 8-layer and 12-layer stacks have already been sent to NVIDIA for quality testing.

Regarding the latest development, TrendForce reports that Samsung is still collaborating with NVIDIA and other major customers on the qualifications for both 8-hi and 12-hi HBM3e products. Samsung anticipates that its HBM3e qualification will be partially completed by the end of 3Q24.

According to TrendForce’s latest analysis on the HBM market, HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50–60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.

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(Photo credit: Samsung)

Please note that this article cites information from Business Korea and Newsdaily.

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