[News] UMC Seamlessly Integrates Key 12-Nanometer Technology as Intel Joins Forces

---

---

As Intel’s January announced the collaboration with UMC on the 12-nanometer process platform, UMC’s Co-General Manager, Jason Wang, led a team to support Intel’s IFS event.

Cited by Commercial Times in its report, Wang emphasized that UMC’s existing customers would have more production location options and benefit from the platform strategy. UMC will seamlessly transition from the 28/22-nanometer to the critical 12-nanometer.

Followed by joint interviews to share insights into the future strategies of both parties, Wang stated that in the face of rapid changes and challenges in the external environment, industries need to strengthen their cooperative relationships and seize opportunities for collaboration.

Intel and UMC announced their collaboration at the end of January, focusing on the development of a shared platform for the 12-nanometer process. In the future, UMC will be able to expand its orders for the front-end of the 12-nanometer process, while Intel will secure orders for the 12-nanometer wafer manufacturing.

Jason Wang emphasized that UMC has a comprehensive solution for the 28/22-nanometer, with demand trending towards stability. However, due to past limitations in resource allocation , UMC has paused at the 14/16-nanometer. Advancing to more advanced processes is just a matter of timing.

Wang further stated that both parties will focus on creating customer value, breaking frameworks, and innovating in cooperation. The two companies complement each other’s strengths, accelerating the timeline for technological development and expanding their global footprint.

Wang revealed that Intel has already included UMC’s 12-nanometer process in its product roadmap and has begun deep collaboration. UMC has deployed personnel to oversee this, with Intel leveraging UMC’s know-how in management.

Additionally, the collaboration involves revenue sharing rather than the rumored licensing fees. They anticipate completing the Process Design Kit (PDK) by next year and achieving mass production by the end of 2026.

Overall, TrendForce views this alliance as a significant step. UMC brings its plentiful experience in mature processes, while Intel contributes its advanced technological prowess.

This partnership is not just about mutual benefits at the 10nm process level; it’s a watchpoint for potentially deeper and more extensive collaboration in their respective fields of expertise. In the dynamic world of semiconductor manufacturing, this Intel-UMC alliance is a fascinating development to keep an eye on.

Read more

• [News] Intel Foundry Unveils its Expanded Process Roadmap for AI Era at Direct Connect 2024 Event
• Strategic Collaboration Between Intel and UMC to Optimize FinFET Foundry Market with Existing Resources, Says TrendForce

(Photo credit: Intel)