[News] Gelsinger Opens Up, as Intel Reportedly Expands Orders to TSMC

2024-02-23 Semiconductors editor

Pat Gelsinger, CEO of Intel, announced on February 22nd that Intel will expand its orders to TSMC, as per a report by Commercial Times.

Following the IFS Direct Connect event in San Jose, USA, Gelsinger pointed out in an interview that two generations of CPU Tiles would be manufactured using TSMC’s N3B process,  marking the official arrival of Intel CPU orders for laptop platforms. 

Gelsinger’s interview confirms that Intel has indeed expanded its outsourcing orders to TSMC. Currently, TSMC is responsible for producing Intel CPUs, GPUs, and NPUs tiles for the Arrow and Lunar Lake platforms.

As per Intel’s product roadmap, Arrow Lake will utilize the Intel 20A process, while Lunar Lake will utilize the 18A process, both incorporating transistor designs such as PowerVia and RibbonFET.

Gelsinger previously stated that Intel Foundry is striving to become the world’s second-largest foundry by 2030. The objective is to fill the fabs and supply the widest range of customers globally, including competitors like NVIDIA and AMD.

According to TrendForce’s data statistics for the third quarter of 2023, the world’s top three foundries were TSMC, Samsung, and GlobalFoundries, with Intel Foundry Services (IFS) ranking ninth at the time.

As for rumors about the US government considering providing over USD 10 billion in subsidies, he disclosed that they expect to receive chip legislation subsidies very soon, although the exact amount is yet to be announced.

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(Photo credit: Intel)

Please note that this article cites information from Commercial Times.