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Despite rollout of full-screen models by major smartphone brands in 4Q17 to stimulate market demand, consumers have been less willing to make purchases amid the saturating market, mobile phone sales have been lower than expected, according DRAMeXchange, a research division of TrendForce. Coupled with the climbing prices of mobile DRAM over the past year and a profit squeeze, major brands have adjusted their production plans and deferred restocking of materials since mid 4Q17. Some key components including mobile DRAM have excess inventory. In 1Q18, the traditional off-season, smartphone vendors are expected to decrease the demand, resulting in a mere 3% rise of the contract prices.
The United States will impose 30% tariff on solar cell and module imports, according to the announcement made by U.S government on January 22. EnergyTrend, a division of TrendForce, makes the following notes regarding the impacts of this new decision on the industry.
WitsView, a division of TrendForce, reports that global LCD TV panel shipments increased quarter by quarter in 2017. 1H17 showed less momentum for holiday sales due to the high prices, but shipments rebounded in 2H17 as the prices declined and TV makers prepared for the year-end sales. Moreover, the new production capacities of BOE’s Gen 8.5 fab in Fuqing and HKC’s Gen 8.6 fab in Chongqing have been focusing on middle-size TV panels (43" and 32" respectively), bringing the annual shipments beyond expectation to 263.83 million pieces, an increase of 1.3% compared with 2016.
Edge computing helps to decrease the load of cloud computing systems and enhance the data processing performance at the edge of the network. This new kind of architecture not only substantially increases the efficiency of computing and data applications, but could also enhance further implementation of emerging technologies like AI and 5G, making it a focus of discussion in 2017. TrendForce forecasts that the edge computing market will grow by a compound annual growth rate (CAGR) of over 30% from 2018 to 2022.
According to TrendForce’s latest report, the Breakdown Analysis of China’s Semiconductor Industry, many fabs are being built in China with high capital expenditures, attracting attention from the industry. In particular, new fab construction projects like Silan Microelectronics and CanSemi etc. will intensify the competition and expand the production capacity of the industry. TrendForce estimates that China’s production capacity of 300mm wafer will reach nearly 700,000 pieces per month by the end of 2018, a 42.2% increase from the end of 2017; the revenue from China’s entire wafer fabrication industry is expected to reach RMB 176.7 billion in 2018, an annual growth of 27.12%.
