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QLED TV and OLED TV Continue to Compete in CES, Featuring 8K Resolution and Intelligent Video Processing

11 January 2018

Competition between QLED TV and AMOLED TV has continued in CES this year, and resolutions of the latest TVs include both 4K and 8K specifications. Major TV brands now focus on video processing chips in addition to constant improvements of HDR (High Dynamic Range) imaging technology, says WitsView, a division of TrendForce. Together with AI technology, TVs are now featuring “smart” video processing capability and superior image quality.

Breakthrough for In-Display Fingerprint Sensor Will Raise Penetration of Fingerprint Recognition in Smartphone Market to 60% in 2018, Says TrendForce

11 January 2018

Fingerprint sensors will still be the first choice for most Andriod phones in 2018, since other biometric authentication methods available for Andriod phone makers cannot completely replace fingerprint identification yet, says TrendForce. Meanwhile, in-display fingerprint sensors are expected to make breakthrough this year, and vendors like Samsung, LG, OPPO, Vivo, Xiaomi, Huawei are likely to embed this technology, bringing the global fingerprint sensor penetration rate in smartphones to 60%.

​Server DRAM Prices Keep Climbing, as Internet Data Centers from North America Drive the Demand, Says TrendForce

10 January 2018

According to the latest report of DRAMeXchange, a division of TrendForce, the price of server DRAM will continue to rise as the supply remains tight in 1Q18. Meanwhile, previous 2133MHz products will be overtaken by higher clock rate (2666MHz and 2400MHz) production, so high-bandwidth server modules will become the mainstream products.

​Micron and Intel’s Decision of Parting Ways in NAND Flash Development Will Not Impact Their Businesses Until 2020, Says TrendForce

10 January 2018

Micron Technology and Intel will discontinue their partnership on NAND Flash development after completing the development of their third generation of 3D-NAND Flash (96-layer), according to their announcements on January 8, 2018. The two will part ways in developing NAND Flash technology due to their individual business needs, but will continue to jointly develop and manufacture 3D XPoint at their fab in Lehi, Utah. DRAMeXchange, a division of TrendForce, points out that 96-layer 3D-NAND Flash will not become the mainstream products until 2019, so this decision of parting ways will not influence their product roadmaps until 2020.

TrendForce Says Prices of LED Package Products Will Go Down in 1Q18, Suppliers Continue to Develop Markets with Higher Growth Rate

9 January 2018

LEDinside, a division of TrendForce, reports that the prices of mainstream LED package products in China's market were generally stable in December 2017. In both high-power and mid-power segments, prices witnessed no obvious fluctuation, but the prices of LED package products are expected to go down in 1Q18.


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