As Samsung pushes to accelerate 1c DRAM development and regain ground in the HBM4 race, current leader SK hynix is pulling ahead with custom HBM solutions for tech giants. According to the Korea Economic Daily, its first customized HBM—likely HBM4E—is set to debut in the second half of 2026. ...

As AI chip giants like NVIDIA and AMD race ahead with next-gen HBM adoption, SK hynix is reportedly taking a more cautious stance on the investment in 1c DRAM (6th-gen 10nm-class), according to South Korean media outlet the bell. The move reflects the company’s strategy to double down on the more ...

Following its March rollout of 12-layer HBM4 samples, SK hynix unveiled a long-term DRAM roadmap and sustainability vision at the 2025 IEEE VLSI Symposium in Kyoto (June 8–12), highlighting plans for sub-10nm technologies, according to its press release and ZDNet. Notably, in his keynote on Jun...

As memory giants reportedly brace for price hikes on DDR4 and DDR5, NAND suppliers are also seeing stronger-than-expected momentum in Q2. According to Commercial Times, the top five NAND Flash makers have cut production, fueling an upswing in memory pricing. The report suggests that major NAND ma...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...