[News] SK hynix Reportedly Leads Custom HBM4E Push with NVIDIA, Microsoft; Samsung Trails with HBM4

As Samsung pushes to accelerate 1c DRAM development and regain ground in the HBM4 race, current leader SK hynix is pulling ahead with custom HBM solutions for tech giants. According to the Korea Economic Daily, its first customized HBM—likely HBM4E—is set to debut in the second half of 2026.

The report indicates that SK hynix has landed major clients, including NVIDIA, Microsoft, and Broadcom, for its custom HBM, putting the South Korean chipmaker at the cutting edge of both tailored and general-purpose AI memory markets.

Notably, SK hynix has recently started tailoring HBM to meet individual client needs, with NVIDIA’s tight delivery schedule influencing its partner selection, the report adds.

Custom HBM Updates: Samsung and Micron

Meanwhile, The Korea Economic Daily reports that Samsung is also in advanced talks with Broadcom and AMD to supply customized HBM. However, unlike SK hynix’s HBM4E, Samsung’s offering is expected to be HBM4, a generation behind, according to the report.

During Samsung’s April earnings call, the company hinted it could start delivering HBM4 to clients as early as the first half of 2026, as per the Korea Economic Daily.

According to TrendForce, current HBM3e base dies utilize a memory-only architecture that acts as simple signal pass-throughs. In contrast, SK hynix and Samsung are collaborating with foundries to adopt a logic-based base die design for HBM4. This new approach enables closer integration between HBM and SoC, offering lower latency, improved data path efficiency, and greater stability in high-speed transmission environments.

As noted by the Korea Economic Daily, TSMC will produce the logic dies—HBM’s “brain”—for SK hynix’s customized chips.

In terms of Micron’s progress on custom HBM, a previous Tom’s Hardware report suggested that the U.S. memory giant is expected to start HBM4 mass production in 2026, with HBM4E following in later years. Notably, along with faster data transfer rates, Micron’s HBM4E will also offer customizable base dies, the report noted.

Read more

• [News] Micron Ships HBM4 Samples with 1ß Process to Multiple Customers, Reportedly Including NVIDIA
• [News] SK hynix Reportedly Slows 1c DRAM Investment, Shifts Focus to 1b DRAM for HBM3E/HBM4

(Photo credit: SK hynix)