Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi...

In the HBM industry, performance metrics such as speed and stack count typically draw the most attention, but power efficiency is emerging as an equally critical factor. According to Hankyung, as the industry transitions to HBM4E, Samsung is proposing a structural redesign of the HBM4 power network....

As the HBM4 battle heats up this year, memory giants are ramping up HBM4E development, where custom HBM is expected to become one of the mainstreams. According to The Elec, Samsung’s custom HBM4E design is set to be completed by May–June 2026, with SK hynix and Micron on a similar timeline. T...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

As HBM4 heads toward mass production in 2026, industry players are beginning to look ahead to HBM4E as the next stage of development. According to Chosun Biz, citing industry sources, with HBM4E the market is expected to move beyond standardized, mass-produced products toward more customized solutio...