Amid tightening memory supply, the industry is shifting focus to high-margin, cutting-edge products catering to hyperscalers. Legacy, consumer-oriented memory is gradually reaching end-of-life, with 2026 poised as a watershed year for key players. Here’s a look at how Samsung, SK hynix, and Micron...

Memory giants are treading carefully on NAND capacity expansion and phasing out older products like MLC (Multi-Level Cell), while doubling down on advanced technologies. Notably, at the San Francisco 2025 IEDM conference in December, SK hynix unveiled its cutting-edge 5-bit NAND flash, claiming read...

As previously reported by ZDNet, SK hynix is exploring plans for its first U.S. HBM packaging facility. Meanwhile, the memory giant is accelerating its domestic expansion, announcing today a KRW 19 trillion investment in a new advanced packaging fab, P&T7, at its Cheongju site. The facility is p...

SK hynix is expected to continue using its MR-MUF process for HBM4 16-high products. According to DealSite, the company evaluated adopting fluxless bonding for HBM4 16-high but ultimately opted to retain its existing advanced MR-MUF process, concluding that the technology remains premature given per...

At CES 2026, NVIDIA takes the lead with its next-generation Rubin, positioning itself as the initial, exclusive HBM4 client currently. While the AI chip giant is certainly reshaping the HBM4 landscape, TrendForce observes it has pushed per-pin speeds above 11 Gbps, forcing SK hynix, Samsung, and M...