Microsoft unveiled its latest in-house AI chip, Maia 200, marking a further push into custom silicon for data-center AI workloads. According to the company’s press release, the chip is fabricated on TSMC’s 3nm process and features native FP8 and FP4 tensor cores designed to enhance performance a...

As the HBM4 battle heats up this year, memory giants are ramping up HBM4E development, where custom HBM is expected to become one of the mainstreams. According to The Elec, Samsung’s custom HBM4E design is set to be completed by May–June 2026, with SK hynix and Micron on a similar timeline. T...

Amid soaring memory prices driven by tight supply and strong demand, Samsung and SK hynix are set to release their fourth-quarter 2025 earnings on January 29, attracting keen market attention as it marks the first time both giants will report on the same day. Ahead of their earnings calls next week,...

Memory prices continue to surge amid tight supply, pushing both makers and buyers into a delicate balancing act. According to Commercial Times, long-term supply agreements (LTAs) are shifting away from the old model that locked in both price and volume, as the trend favors deals that guarantee commi...

A potential risk may be emerging for the memory industry, with Korean memory makers increasingly exposed to U.S. policy developments. According to Wccftech, speaking at Micron’s New York fab groundbreaking ceremony, U.S. Commerce Secretary Howard Lutnick said that memory producers without domestic...