As the NAND race heats up, Samsung has revealed its roadmap, aiming to develop 1,000-layer NAND by 2030, according to the bell. To achieve the goal, the memory giant plans to introduce a "multi-BV" NAND structure, stacking four wafers to break structural limits, the report suggests. Citing Song J...

As memory giants fiercely compete to push the limits of NAND technology, a surprising twist has emerged: Samsung is reportedly set to use a hybrid bonding patent from China’s YMTC, starting with its V10 (10th generation) NAND, according to the latest ZDNet report. The report indicates that Sams...

According to a report from ijiwei, citing Pune News, Samsung Electronics is assessing the potential impact of Trump’s tariff policies on its supply chain. The report indicates that the tech giant is reportedly considering options to relocate its smartphone manufacturing operations out of China. ...

President Trump may not stop the $53 billion CHIPS Act outright, but his moves could slow fund distribution for U.S. chip fabs. Bloomberg and The Register report that the National Institute of Standards and Technology (NIST), under the Commerce Department, plans to cut up to 500 probationary staffer...

According to a report from MoneyDJ, citing Semiconductor Digest and Tom’s Hardware, building a semiconductor fab in the U.S. costs twice as much and takes twice as long as in Taiwan, as highlighted by Herbert Blaschitz, Executive Vice President at Exyte, a leading provider of engineering solutions...