As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...

While Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to major customers, the firm also notes that although GPUs will remain the main growth engine, ASICs are set to see even faster adoption in 2026. Building on this, Chosun Biz notes that th...

According to a report from Liberty Times, citing South Korean outlet FNnews, sources say that Samsung has deployed personnel with expertise across various fields of chip manufacturing to its plant in Texas. Wccftech notes that the move is likely aimed at accelerating construction of the Taylor facil...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

During Jensen Huang’s visit to Beijing, NVIDIA revealed that the AI chip giant plans to restart sales of its H20 AI accelerator in China, after receiving assurances from the U.S. government that export licenses will be granted, according to Bloomberg. Notably, as per South Korean media outlet B...