According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

During Jensen Huang’s visit to Beijing, NVIDIA revealed that the AI chip giant plans to restart sales of its H20 AI accelerator in China, after receiving assurances from the U.S. government that export licenses will be granted, according to Bloomberg. Notably, as per South Korean media outlet B...

As Samsung launches its latest foldables — the Galaxy Z Flip7 and Z Fold7— eyes are now turning to Apple’s first foldable iPhone. Samsung Display has reportedly secured a multi-year exclusive deal to supply foldable OLED panels for the device, set to debut in 2026, according to ETNews. The...

On July 8, Cadence officially announced via its WeChat account that the U.S.-based company has recently decided to expand its collaboration with Samsung Foundry. The two parties have signed a new multi-year IP agreement to extend the deployment of Cadence® memory and interface IP solutions on Samsu...

According to South Korean outlet DealSite, Samsung Electronics’ weaker-than-expected second-quarter results have renewed focus on its foundry business. The report notes that while the company has recently secured some legacy process orders, securing major contracts from global tech giants for adva...