Samsung Electronics’ NAND flash facility in Xi’an, China, is reportedly seeing a decline in wafer output as it undergoes equipment upgrades. According to Chosun Biz, monthly NAND wafer production has declined year on year, with output estimated to have fallen by about 5%–6% from a previous lev...

Cristiano Amon, CEO of Qualcomm, reportedly arrived in South Korea on April 21 and is scheduled to meet with executives from Samsung Electronics and SK hynix in succession. According to Hankyung, a key focus of his visit may be potential collaboration with Samsung Foundry. He is expected to meet wit...

As NVIDIA accelerates adoption of SOCAMM2 (Small Outline Compression Attached Memory Module 2), competition among memory heavyweights is intensifying. Following Micron’s shipment of 256GB SOCAMM2 samples in early March, SK hynix announced on April 20 that it has kicked off mass production of 192GB...

Samsung Electro-Mechanics and LG Innotek have reportedly initiated efforts to secure co-packaged optics (CPO) technology. According to ETNews, sources indicate that both companies have accelerated their push to integrate CPO into AI semiconductor substrates. Moving beyond the conceptual stage, they ...

Since April 2026, global semiconductor packaging and testing sector has seen a wave of major developments. ASE has kicked off its largest-ever fab construction program, with six new facilities slated to break ground worldwide this year. Meanwhile, Samsung Electronics plans to invest USD 4 billion in...