SK hynix’s yields for hybrid bonding HBM have reportedly improved, although the company did not disclose specific figures. According to The Elec, Kim Jong-hoon, Technical Leader at SK hynix, said validation of its 12-high HBM using hybrid bonding has been completed, adding that the company is now ...

As global memory supply remains extremely tight amid the AI boom, Samsung’s looming large-scale strike is seen as further intensifying the strain. According to South Korean media outlets News1 and The Dong-A Ilbo, citing analysts, disruptions could reach 3–4% for DRAM and 2–3% for NAND, based ...

Amid disruptions in the Middle East, shortages of key materials are raising concerns across the global semiconductor supply chain. According to South China Morning Post, citing The Elec, the Strait of Hormuz has been effectively closed since early March, sharply curtailing supplies of naphtha—a ke...

DRAM scaling is becoming increasingly complex as the industry moves deeper into advanced process nodes below 10nm-class levels. The Elec reports that Samsung produced wafers using its 10a DRAM process in March and confirmed a working die during device characterization testing. Notably, this marks th...

Another wave of SSD price increases may be on the horizon. According to Wccftech, citing Chinese outlet ITHome, sources say Samsung Electronics has issued a notice raising SSD prices by more than 10%, while Kingston is also set to increase prices across its entire SSD lineup starting this week, wit...