As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

As HBM has emerged as a key battle ground for memory giants amid the surging demand for AI, Micron has created a dedicated business unit for HBM. The company says in its press release that the new structure will be in place by early fiscal Q4, starting May 30, 2025, and financial reporting will foll...

As memory giants brace for price hikes, Micron, following SanDisk's lead, has informed its customers about the upcoming increases, as indicated by industry sources.     Micron’s HBM Sold Out for 2025, Demand Soars into 2026 As noted in Micron’s message to clients on Mar...

According to a report from the Korean media outlet The Financial News, citing industry sources, NVIDIA made another visit to Samsung Electronics' Cheonan packaging plant earlier this week, roughly a month after its previous inspection. The report suggests that this visit indicates the final quality ...

Recently, SK Hynix announced the full-scale commencement of construction on the first wafer plant within its Yongin Semiconductor Cluster, with completion expected in May 2027. In July 2024, the SK Hynix board of directors approved an investment of approximately 9.4 trillion KRW (about $6.67 bill...