Beyond its September reveal of a multi-year Ascend AI chip roadmap through 2028—complete with proprietary HBM development—Huawei is making equally aggressive moves in enterprise storage. At its Huawei Connect Europe event in Madrid, the tech giant rolled out a sweeping refresh of its storage por...

Competition among global memory giants has been intensifying, and Micron has reportedly stepped up its recruitment efforts, actively targeting skilled engineers for its expanding global operations. According to Hankyung, sources indicate that Micron is using LinkedIn to recruit engineers with experi...

With top memory makers reportedly raising prices amid tight supply, The Chosun Daily, citing TrendForce, highlights that by the end of Q3 2025, global DRAM inventories averaged just 3.3 weeks—matching the lows of 2018 and signaling a supercycle in the memory market could be on the way. The repo...

With HBM turning into a scarce resource in the AI boom and imports effectively off-limits, China is racing to develop its own supply, with major tech firms joining the push. Reuters reports that Yangtze Memory Technologies Co. (YMTC), the country’s leading NAND maker, is gearing up to enter the DR...

According to The Elec, KAIST Professor Kim Jeong-ho noted that HBF (High Bandwidth Flash)—NAND flash stacked like HBM—could become a decisive factor for the future of AI. As the report explains, HBF resembles HBM in structure, with dies stacked and linked by through-silicon vias (TSVs). The key ...