Rising memory prices are expected to lift production and drive stronger demand for chipmaking equipment. According to Nikkei, Toshiki Kawai, president of Tokyo Electron, said the wider adoption of AI is boosting chip demand, prompting memory makers to ramp up equipment purchases from 2026. As a resu...

As SK hynix continues to advance next-generation memory, the company is also reportedly moving to build capabilities in cutting-edge packaging technologies. According to ZDNet, sources say SK hynix is preparing to set up its first 2.5D packaging mass-production line at a new U.S. packaging facility ...

As AI infrastructure ramps up, memory supply tightens and prices soar. Commercial Times, citing industry experts, projects that cloud high-speed memory consumption could reach 3 exabytes (EB) by 2026. Notably, when factoring in the "equivalent wafer usage" of high-speed memory like HBM and GDDR7, th...

As China’s top memory firms race to advance next-gen DRAM and NAND, domestic chip equipment makers are stepping up for a slice of the booming HBM market as well. According to ijiwei, ACM Research has introduced several solutions optimized for HBM production and plans to release HBM4-compatible cle...

Micron Technology has announced plans to invest JPY 1.5 trillion (approximately USD 9.6 billion) to build a new factory dedicated to high-bandwidth memory (HBM) chip production in Hiroshima, Japan. The facility will be located within Micron’s existing Hiroshima site, with construction scheduled to...