Samsung is stepping up its development of custom HBM logic dies. According to ZDNet, sources say the company is designing logic dies for custom HBM using foundry process nodes as advanced as 2nm. The report adds that Samsung Electronics previously applied a 4nm process to the logic die used in HBM4 ...

As AI workloads continue to grow, high-bandwidth flash (HBF) is gaining momentum, with experts forecasting earlier-than-expected commercialization. According to Sisa Journal, KAIST professor Joungho Kim—widely regarded as the “father of HBM”—indicates that Samsung Electronics and SanDisk pla...

At a time when the memory industry is in the midst of a boom deeply driven by artificial intelligence (AI), major memory makers are unanimously shifting their strategic focus toward AI-oriented storage solutions featuring high bandwidth, large capacity, and low power consumption. As demand for high-...

Rising memory prices are expected to lift production and drive stronger demand for chipmaking equipment. According to Nikkei, Toshiki Kawai, president of Tokyo Electron, said the wider adoption of AI is boosting chip demand, prompting memory makers to ramp up equipment purchases from 2026. As a resu...

As SK hynix continues to advance next-generation memory, the company is also reportedly moving to build capabilities in cutting-edge packaging technologies. According to ZDNet, sources say SK hynix is preparing to set up its first 2.5D packaging mass-production line at a new U.S. packaging facility ...