Samsung Electronics is reportedly developing a next-generation HBM packaging technology aimed at bringing high-performance on-device AI to mobile devices. According to ETNews, sources say the company is working on a “Multi Stacked FOWLP” technology that combines ultra-high-aspect-ratio copper pi...

Intel is collaborating with SoftBank’s subsidiary SAIMEMORY to advance a potential alternative to conventional high-bandwidth memory (HBM). According to TechPowerUp, SAIMEMORY plans to present a paper at VLSI Symposium 2026 in June, detailing its newly developed HB3DM memory based on Z-Angle Memor...

Please note that this article cites information from The Elec, Investing.com, News 1, Alphabiz, and EBN. After Micron stunned the market with soaring margins—projected to reach 81% in 3QFY26, up from a record 75% in the previous quarter—the industry is keen to understand the drivers behind. On...

As Samsung and SK hynix battle for dominance in memory—particularly in the red-hot HBM market—an unexpected challenger could be emerging. South Korean outlet EBN reports that amid the unprecedented boom in HBM demand, the country’s chipmakers are increasingly becoming prime targets for non-pra...

BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...