Subject


HBM


2025-08-04

[News] South Korea Posts Record July Chip Exports, Up 31.6% YoY on HBM and DDR5 Demand

According to MoneyDJ, citing South Korean media outlet Yonhap News, South Korea’s Ministry of Trade, Industry and Energy announced on August 1 that exports in July 2025 reached USD 60.82 billion—an impressive 5.9% increase year-over-year—setting a new record high for the month of July and mark...

2025-07-30

[News] Samsung Reportedly Mulls Taylor Expansion, Advanced Packaging in Sight After Tesla Deal

According to South Korean media outlet The Korea Economic Daily, Samsung is reportedly considering further investment in its Taylor, Texas plant. Specifically, the company is said to be reviewing the addition of an advanced packaging line alongside its foundry and R&D facilities. The report n...

2025-07-22

[News] SK hynix’s HBM4 Lead Shrinks as Rivals Close Gap Ahead of 2026 Shakeup

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

2025-07-21

[News] HBM Demand from ASICs Reportedly to Surge 80% in 2026, Fueling Samsung–SK hynix–Micron Rivalry

While Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to major customers, the firm also notes that although GPUs will remain the main growth engine, ASICs are set to see even faster adoption in 2026. Building on this, Chosun Biz notes that th...

2025-07-15

[News] LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028

As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily. Sedaily suggests a...

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