As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, e...

According to Commercial Times, after reports that Samsung will halt 1y and 1z nm 8GB DDR4 production starting in April, Micron has also informed customers it will discontinue legacy DDR4 modules for servers. This shift reflects a broader industry trend, as memory makers accelerate product transiti...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

As HBM has emerged as a key battle ground for memory giants amid the surging demand for AI, Micron has created a dedicated business unit for HBM. The company says in its press release that the new structure will be in place by early fiscal Q4, starting May 30, 2025, and financial reporting will foll...