While Broadcom signaled strong demand from Google TPUs via Anthropic during last week’s earnings call, another leading Taiwanese ASIC supplier, MediaTek, is reported by the Economic Daily News to have secured orders for Google’s v7e and v8e TPUs. Supply chain sources cited by the report note tha...

Recent reports that Apple and Qualcomm are recruiting engineers with EMIB (Embedded Multi-die Interconnect Bridge) expertise suggest Intel’s packaging technology is regaining momentum—helped in part by the tight squeeze on TSMC’s capacity. According to the Commercial Times, the shift indicates...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028. The report also details TSMC...

According to TechNews, citing TechPowerUp and Wccftech, Apple’s next-generation M5 chips—set to be used in new MacBook Pro models launching in 2026—will reportedly feature a major upgrade in packaging technology, adopting LMC (Liquid Molding Compound) exclusively supplied by Taiwan’s Eternal...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...