With the approach to the end of 2023, TrendForce revealed the tech trends in every sector, apparently, AI continues as the main focus to decide the direction of how the tech supply chain will be in the next few years, here are the seeings:

CSPs increase AI investment, driving a 38% growth in AI server shipments by 2024

• CSPs increase AI investment, fueling a 38% growth in AI server shipments by 2024.
• Major CSPs like Microsoft, Google, and AWS are driving this growth due to the rising popularity of AI applications, pushing AI server shipments to 1.2 million units in 2023.

HBM3e set to drive an annual increase of 172% in HBM revenue

• Major memory suppliers are set to introduce HBM3e with faster speeds (8 Gbps) to enhance the performance of AI accelerator chips in 2024–2025.
• HBM integration is becoming common among GPU manufacturers like NVIDIA and AMD, and it is expected that HBM will significantly contribute to memory suppliers’ revenues in 2024, with an annual growth rate of 172%.

Rising demand for advanced packaging in 2024, the emergence of 3D IC technology

• Leading semiconductor firms like TSMC, Samsung, and Intel are emphasizing advanced packaging technology’s importance in boosting chip performance, conserving space, reduce power usage, and minimize latency. They’re establishing 3D IC research centers in Japan to underscore this role.
• Generative AI is driving increased demand for 2.5D packaging tech, integrating computing chips and memory with a silicon interposer layer. Additionally, 3D packaging solutions like TSMC’s SoIC, Samsung’s X-Cube, and Intel’s Foveros.

NTN is set to begin with small-scale commercial tests, broader applications of this technology are on the way in 2024

• Collaboration between satellite operators, semiconductor firms, telecom operators, and smartphone makers is growing due to increased satellite deployments by operators. This collaboration focuses on mobile satellite communication applications and bidirectional data transmission under specific conditions.
• Major semiconductor manufacturers are ramping up efforts in satellite communication chips, leading top smartphone manufacturers to integrate satellite communication into high-end phones using the SoC model, which is expected to drive small-scale commercial testing of NTN networks and promote widespread adoption of NTN applications.

6G communication to begin in 2024, with satellite communication taking center stage

• 6G standardization begins around 2024-2025, with initial technologies expected by 2027-2028. This enables novel applications like Reconfigurable Intelligent Surfaces (RIS), terahertz bands, Optical Wireless Communication (OWC), NTN for high-altitude comms, and immersive Extended Reality (XR) experiences.
• Low-orbit satellites will play a key role in 6G as its standards solidify, peaking around the time of 6G commercialization. The use of drones for 6G communication and environmental sensing is also set to surge in the 6G era.

Innovative entrants drive cost optimization for Micro LED technology in 2024

• In 2023, the focus in Micro LED display technology is on cost reduction through chip downsizing, aiming for at least a 20-25% annual reduction. A hybrid transfer approach, combining stamping and laser bonding, is gaining attention for efficient mass production.
• Micro LED holds potential in micro-projection displays for transparent AR lenses. Challenges include achieving ultra-high PPI with 5 µm or smaller chips, particularly with red LEDs’ low efficiency. Various innovative approaches, such as InGan-based red LEDs and vertically stacked RGB LEDs.

Intensifying competition in AR/VR micro-display technologies

• Increasing AR/VR headset demand drives demand for ultra-high PPI near-eye displays, with Micro OLED technology at the forefront, poised for broader adoption.
• Challenges in brightness and efficiency impact Micro OLED displays and their dominance in the head-mounted display market depends on the development of various micro-display technologies.

Advancements in material and component technologies are propelling the commercialization of gallium oxide

• Gallium oxide (Ga₂O₃) is gaining prominence for next-gen power semiconductor devices due to its potential in high-voltage, high-temperature, and high-frequency applications in EVs, electrical grids, and aerospace.
• The industry is already producing 4-inch gallium oxide mono-crystals and advancing Schottky diode and transistor fabrication processes, with the first Schottky diode products expected by 2024.

Solid-state batteries poised to reshape the EV battery landscape over the next decade

• Major automakers and battery manufacturers are investing in solid-state and semi-solid-state battery technologies, aiming for a new cycle of technological iteration by 2024.
• After Li-ion batteries, sodium-ion batteries, with lower energy density, are suitable for budget-friendly EVs, and hydrogen fuel cells offer long-range and zero emissions, primarily for heavy-duty commercial vehicles, with widespread adoption expected after 2025, despite challenges.

BEVs in 2024 rely on power conversion efficiency, driving range, and charging efficiency

• Automakers are optimizing battery pack structures and material ratios to increase energy density and driving range. Solid-state batteries, with high energy density, may see limited installations in vehicles as semi-solid batteries in 2H23.
• The 800V platform will enable high-power fast charging, leading to the expansion of high-power charging stations. AI advancements are driving EVs toward advanced autonomous driving, with Tesla’s Dojo supercomputer investing in neural network training to maintain its position in the intelligent driving market.

Green solutions with AI simulations emerging as a linchpin for renewable energy and decarbonized manufacturing

• Under the background of optimizing energy consumption, creating interconnected data ecosystems, and visualizing energy flow and consumption. Carbon auditing tools and AI are key for organizations aiming to reduce carbon emissions and enhance sustainability.
• The IEA predicts global renewable energy generation to reach 4,500 GW by 2024, driven by policy support, rising fossil fuel prices, and energy crises. The adoption of AI-driven smart technologies in peripheral systems for stable energy generation.

OLED’s expansion will across various applications driven by the innovation of foldable phones

• OLED folding phones are improving in design by using lightweight materials, innovative hinge structures, and cost-reduction efforts to approach the thickness and weight of traditional smartphones.
• In the IT sector, industry players like Samsung, BOE Technology, JDI, and Visionox are making significant investments and developments in OLED technology to expand into various markets. Anticipated advancements in technology and materials are expected to increase OLED market penetration by 2025.

Source to China Times, in response to increased visibility in AI server orders and optimistic future demand, two ODM-Direct based in Taiwan, Wiwynn, and Quanta, are accelerating the expansion of their server production lines in non-Chinese regions. Recently, there have been updates on their progress. Wiwynn has completed the first phase of its self-owned new factory in Malaysia, specifically for L10. As for Quanta, has further expanded its L10 production line in California, both gearing up for future AI server orders.

Wiwynn’s new server assembly factory, located in the Senai Airport City in Johor, Malaysia, was officially inaugurated on the 12th, and it will provide full cabinet assembly services for large-scale data centers. Additionally, the second phase of the front-end server motherboard production line is expected to be completed and operational next year, allowing Wiwynn to offer high-end AI servers and advanced cooling technology to cloud service providers and customers in the SEA region

While Wiwynn has experienced some slowdown in shipments and revenue due to its customers adjusting to inventory and CAPEX impacts in recent quarters, Wiwynn still chooses to continue its overseas factory expansion efforts. Notably, with the addition of the new factory in Malaysia, Wiwynn’s vision of establishing a one-stop manufacturing, service, and engineering center in the APAC region is becoming a reality.

Especially as we enter Q4, the shipment of AI servers based on NVIDIA’s AI-GPU architecture is expected to boost Wiwynn’s revenue. The market predicts that after a strong fourth quarter, this momentum will carry forward into the next year.

How significant is the demand for AI servers?

According to TrendForce projection, a dramatic surge in AI server shipments for 2023, with an estimated 1.2 million units—outfitted with GPUs, FPGAs, and ASICs—destined for markets around the world, marking a robust YoY growth of 38.4%. This increase resonates with the mounting demand for AI servers and chips, resulting in AI servers poised to constitute nearly 9% of the total server shipments, a figure projected to increase to 15% by 2026. TrendForce has revised its CAGR forecast for AI server shipments between 2022 and 2026 upwards to an ambitious 29%.

Quanta has also been rapidly expanding its production capacity in North America and Southeast Asia in recent years. This year, in addition to establishing new facilities in Vietnam, they have recently expanded their production capacity at their California-based Fremont plant.

The Fremont plant in California has been Quanta’s primary location for the L10 production line in the United States. In recent years, it has expanded several times. With the increasing demand for data center construction by Tier 1 CSP, Quanta’s Tennessee plant has also received multiple investments to prepare for operational needs and capacity expansion.

In August of this year, Quanta initially injected $135 million USD into its California subsidiary, which then leased a nearly 4,500 square-meter site in the Bay Area. Recently, Quanta announced a $79.6 million USD contract awarded to McLarney Construction, Inc. for three construction projects within their new factory locations.

It is expected that Quanta’s new production capacity will gradually come online, with the earliest capacity expected in 2H24, and full-scale production scheduled for 1H25. With the release of new high-end AI servers featuring the H100 architecture, Quanta has been shipping these products since August and September, contributing to its revenue growth. They aim to achieve a 20% YoY increase in server sales for 2023, with the potential for further significant growth in 2024.

Source to UDN, the DRAM market has been buzzing with positive developments lately, and may get a chance to see an upturn by the end of the year. Among the key factors driving this optimism is the DDR5 specification DRAM, which is poised to capitalize on opportunities in AI servers and laptops next year, gradually increasing demand.

After more than a year of corrections, the DRAM market is finally showing signs of improvement. Major DRAM manufacturers like Samsung and SK Hynix are still reducing production capacity, but their focus is primarily on DDR4 specification DRAM. Industry sources suggest that Samsung, in response to the growing demand for DDR5 DRAM, is set to significantly ramp up DDR5 production in the fourth quarter of this year, anticipating strong order demand next year.

In fact, such as Intel and AMD are planning to introduce new platforms next year that will support DDR5 specification DRAM, indicating a gradual decline in DDR4 demand. Beyond the consumer market, the server market is expected to experience a substantial surge in DDR5 demand, driven by the imminent launch of Intel’s fifth-generation server platform, Emerald Rapids, which fully supports DDR5. As AI server demand gains momentum, DDR5 demand is poised to enter a high-growth phase.

(Source: https://money.udn.com/money/story/5612/7488629 ; Image credit: Micron)

In the third quarter of 2023, the passive component industry’s inventory has returned to normal levels. However, it continues to deplete due to sluggish end-demand. Nevertheless, downstream customers in the mobile phone and automotive sectors have begun rebuilding their inventories. Ample Electronic Technology, a major manufacturer of conductive paste and thick-film conductor materials, has already seen a recovery in its August 2023 revenue, indicating that the inventory adjustment process in the passive component industry, which began in the fourth quarter of 2021, has gradually bottomed out over nearly two years.

TrendForce Insights:

• Upstream operations in the passive component industry are rebounding, but true demand recovery awaits.

In the second quarter of 2023, the passive component industry’s inventory approached normal levels. However, due to weak end-demand, Chinese smartphone and PC manufacturers significantly reduced their component inventories in the second quarter of 2023, leading to continued poor performance for passive component manufacturers. It is expected that after hitting the bottom in the third quarter of 2023, operations will gradually improve. However, the timing of true demand recovery may need to wait until 2024, given the persistently sluggish consumer electronics market.

• AI servers are on the rise, and inductive components are in demand.

General-purpose servers primarily use molding power inductors, with quantities ranging from 20 to 30, an ASP of approximately $0.07 to $0.1 per unit, and a current rating of only 30 to 40A. In contrast, AI servers have power consumption levels generally exceeding 1000W. To improve transient response performance, each AI server requires an additional 10 TLVR (Trans Inductor Voltage Regulator) inductors, with an ASP of around $0.3 per unit. This significantly increases the revenue of inductance components for AI servers compared to general-purpose servers.

• Promising prospects in the automotive market, but validation takes time.

Conventional internal combustion engine vehicles require approximately 300 to 500 MLCCs (Multilayer Ceramic Capacitors), while Battery Electric Vehicles (BEVs) require between 2,000 and 2,500 MLCCs. Self-driving systems will also drive MLCC demand. For instance, in the case of automotive camera modules, the quantity increases from 2 to 10 to 15. From a holistic perspective, non-self-driving internal combustion engine vehicles require around 3,000 MLCCs, Hybrid Electric Vehicles (HEVs) with Level 2 autonomy need over 6,000 MLCCs, and Level 3 Electric Vehicles (EVs) require more than 10,000 MLCCs. This leads to a significant increase in the revenue of automotive MLCCs.

However, entering the automotive sector is challenging and requires at least 1 to 2 years for certification. Nevertheless, once established, it can secure long-term agreements for at least 5 years. Additionally, compared to the slowing growth of the consumer electronics market, the automotive sector offers substantial opportunities and provides a buffer against the cyclicality of passive component industries.

According to Liberty Times Net, Inventec, a prominent player in the realm of digital technology, is making significant strides in research and development across various domains, including artificial intelligence, automotive electronics, 5G, and the metaverse. The company has recently introduced a new all-aluminum liquid-cooled module for its general-purpose graphics processing units (GPGPU) powered by NVIDIA’s A100 chips. Additionally, this innovative technology is being applied to AI server products featuring AMD’s 4th Gen EPYC dual processors, marking a significant step towards the AI revolution.

Inventec has announced that their Rhyperior general-purpose graphics processors previously offered two cooling solutions: air cooling and air cooling with liquid cooling. The new all-aluminum liquid-cooled module not only reduces material costs by more than 30% compared to traditional copper cooling plates but also comes with 8 graphics processors (GPUs) and includes 6 NVIDIA NVSwitch nodes. This open-loop cooling system eliminates the need for external refrigeration units and reduces fan power consumption by approximately 50%.

Moreover, Inventec’s AI server product, the K885G6, equipped with AMD’s 4th Gen EPYC dual processors, has demonstrated a significant reduction in data center air conditioning energy consumption of approximately 40% after implementing this new cooling solution. The use of water as a coolant, rather than environmentally damaging and costlier chemical fluids, further enhances the product’s appeal, as it can support a variety of hardware configurations to meet the diverse needs of AI customers.

Inventec’s new facility in Mexico has commenced mass production, with plans to begin supplying high-end NVIDIA AI chips, specifically the H100 motherboards, in September. They are poised to increase production further in the fourth quarter. Additionally, in the coming year, the company is set to release more Application-Specific Integrated Circuit (ASIC) products, alongside new offerings from NVIDIA and AMD. Orders for server system assembly from U.S. customers (L11 assembly line) are steadily growing. The management team anticipates showcasing their innovations at the Taiwan Excellence Exhibition in Dongguan, China, starting on October 7th, as they continue to deepen their collaboration with international customers.

(Source: https://ec.ltn.com.tw/article/breakingnews/4412765)