MediaTek announced Monday evening that it plans to issue US$3.9 billion in ECBs, which are scheduled to list on the Singapore Exchange on September 8. NVIDIA, as a strategic investor, will subscribe to 17,500 units worth US$3.5 billion, accounting for nearly 90% of the total offering, Commercial Tim...

On August 24, JSG (Jingsheng Mechanical & Electrical) released an investor relations record detailing the latest progress across its semiconductor equipment, silicon carbide (SiC) substrate, and diamond materials segments. SiC Substrate & Global Capacity Expansion Technical Breakthroug...

AI chip competition is expanding beyond advanced nodes into advanced packaging and silicon photonics. According to UDN News, MediaTek has been strengthening its capabilities in these areas, with Shang Hou, who recently joined the company as vice president of advanced packaging after retiring from TS...

TSMC is stepping up its technology roadmap to meet surging AI computing demand. According to TechNews, April Li, Global Head of AI and HPC Business Development at TSMC, said at SEMICON Taiwan 2026 that AI computing demand is growing fivefold annually, putting increasing pressure on compute capacity...

As Intel pushes to expand its foundry footprint beyond its own chips—from advanced packaging (EMIB) to logic manufacturing—memory makers may be exploring a similar diversification away from TSMC. With the base die becoming a key differentiator in the HBM4 era, SK hynix is reportedly considering ...