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2026-05-06

[News] Google TPU Push Reportedly Meets Cautious Early Adoption from AI Infrastructure Providers

While Google has signaled a strategic shift to offer its Tensor Processing Units (TPUs) to select external customers—moving beyond its legacy internal-only model—market reception among leading AI infrastructure providers remains cautious. Citing The Information, the Chosun Daily reports that spe...

2026-05-05

[News] JSR Reportedly Plans First Taiwan Production Plant to Supply Advanced EUV Photoresists to TSMC

Japan’s semiconductor materials supplier JSR is reportedly planning to build a photoresist plant in Taiwan to supply TSMC. According to Nikkei, the company intends to establish its first semiconductor materials production facility in Taiwan. JSR, which already operates R&D and sales bases in T...

2026-05-05

[News] Intel Reportedly Scales EMIB Expansion in U.S., Vietnam, with Taiwanese Tool Orders Set for 2H26 Delivery

As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Ore...

2026-05-05

[News] Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification

Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially provi...

2026-05-05

[News] Memory Makers Reportedly Tap Substrate Suppliers for DDR6 Prototypes; Commercialization May Start 2028–29

Global memory vendors are stepping up efforts to develop DDR6. According to The Elec, citing sources, leading players including Samsung Electronics, SK hynix, and Micron have recently asked substrate suppliers to initiate early-stage DDR6 development. Key design details have been shared, enabling s...

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