One of the most closely watched issues in the semiconductor equipment space lately is TSMC’s statement that it does not plan to adopt High-NA EUV systems for its A13 node, scheduled around 2029. The move has sparked debate over whether—and to what extent—this decision could impact ASML’s fut...

Custom silicon from hyperscalers continues to gain traction, with MediaTek emerging as a key beneficiary of the accelerating shift. According to Liberty Times, citing CEO Rick Tsai, the company now expects its AI ASIC revenue contribution to double from earlier projections, rising from USD 1 billion...

Qualcomm is stepping up its push into the data center market, targeting custom silicon opportunities with hyperscale customers. According to The Wall Street Journal, CEO Cristiano Amon said the company is working with a leading hyperscaler to develop custom silicon, with initial shipments expected t...

Backed by the Japanese government, Rapidus is pushing toward 2nm mass production by 2027 as it seeks to close the gap with global foundry leaders. Despite this ambitious roadmap, the company’s financial position remains somewhat opaque, drawing market scrutiny. Notably, according to financial d...

Intel is collaborating with SoftBank’s subsidiary SAIMEMORY to advance a potential alternative to conventional high-bandwidth memory (HBM). According to TechPowerUp, SAIMEMORY plans to present a paper at VLSI Symposium 2026 in June, detailing its newly developed HB3DM memory based on Z-Angle Memor...