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2026-05-05

[News] SanDisk Long-Term Deals Gain Scale: Over One-Third of FY27 Bits Reportedly Locked, 50% in Sight; HBF Advances

Long-term agreements are no longer confined to upstream memory suppliers such as Samsung Electronics and SK hynix. At its latest earnings call, SanDisk outlined a clearer picture of its New Business Model (NBM) with customers. According to the transcript from Investing.com, the company has already s...

2026-05-05

[News] Applied Materials to Acquire ASMPT NEXX for $120M, Expanding Panel-Level Advanced Packaging Portfolio

As advanced packaging has emerged as a key growth opportunity amid the AI chip boom, equipment players are also making strategic moves across the value chain. According to ijiwei, Hong Kong–listed ASMPT has entered into a share purchase agreement with U.S. semiconductor equipment giant Applied Mat...

2026-05-05

[News] ASE, Powertech, KYEC CapEx May Hit NT$370B This Year as AI Drives Record OSAT Investment

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

2026-05-04

[News] Micron Says AI Still in Early Stage as Memory Demand Reportedly Seen Exceeding 50% of Total Market This Year

Micron Technology CEO Sanjay Mehrotra said the memory supply crunch is only beginning as AI demand continues to grow. According to Wccftech, citing an interview with CNBC, he noted that AI remains in its early stages and that ongoing advances will require not only faster but also greater amounts of ...

2026-05-04

[News] Kioxia, SanDisk to Demonstrate QLC NAND Using Multi-Stacked Cell Architecture, Targeting 1,000+ Layers

As memory makers accelerate migration toward ~300-layer class NAND, Kioxia and SanDisk are reportedly pushing further ahead. According to EE Times Japan, the companies have achieved a world-first demonstration of quad-level cell (QLC) operation using a multi-stacked cell array CMOS (MSA-CBA) archite...

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