As TSMC continues expanding its U.S. footprint, comments from Cliff Hou, TSMC Senior Vice President and Deputy Co-COO, have caught industry attention. According to Commercial Times, Hou said at the 2026 SelectUSA Investment Summit that the company “is prepared for growth from any new business oppo...

Market chatter continues to link Apple as a potential early adopter of Intel’s 18A-P for future M-series chips, with more technical details expected to surface at the VLSI Symposium in mid-June. Based on information disclosed on the VLSI website, Intel’s enhanced 18A-P process delivers over 18% ...

A research team led by Professor Kong Wei at Westlake University has achieved wafer-scale, damage-free integration of single-crystal molybdenum disulfide (MoS₂) films onto flexible substrates, marking a shift in transfer and integration technology from conventional “wet” processes to a “dry�...

As Beijing continues pushing for greater semiconductor self-sufficiency, Chinese chip companies are allocating a larger share of revenue to R&D. According to South China Morning Post, first-quarter earnings show that China’s leading chipmakers devoted a higher proportion of revenue to research...

Vanguard International Semiconductor (VIS), a TSMC affiliate, commented on its future expansion plans, including those related to VSMC, its Singapore joint venture. According to UDN News, VIS Chairman Leuh Fang said the company is evaluating the construction of a second 12-inch fab, as existing capa...