SK hynix is reportedly stepping up development of 3D-stacked DRAM, a next-generation memory technology for on-device AI. According to ZDNet, the company has reportedly begun recruiting 3D-Stacked DRAM-on-Logic Design Engineers through its U.S. subsidiary in San Jose, California. SK hynix is also sai...

As NVIDIA expands its AI infrastructure roadmap with Rosa, a data center CPU designed for agentic AI workloads beyond Vera, AMD is stepping up its CPU roadmap as well. At Advancing AI 2026 on July 23, AMD revealed that its next-generation Zen 7-based EPYC server CPUs, codenamed “Florence,” are o...

AMD unveils its sixth-generation EPYC 9006 server CPU and Instinct MI455X GPU, expanding its AI portfolio across agentic AI, cloud computing, enterprise, and high-performance computing (HPC). According to Commercial Times, the move is expected to drive demand for TSMC's advanced packaging technologi...

As Intel delivered stronger-than-expected second-quarter results, reportedly posting its fastest quarterly revenue growth since 2011 and hiked its 2026 CapEx target to more than US$20 billion from US$18 billion, one of the earnings call highlights would be its 14A progress. Reuters and Wccftech, cit...

On July 17, HKC announced that it had signed a cooperation agreement with the Administrative Committee of the Shaoxing Area of the Hangzhou–Shaoxing Airport Economic Integration Demonstration Zone to develop an advanced semiconductor packaging and testing project. The company plans to invest CN...