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2026-07-29

[News] 7.1 Kumamoto Earthquake: TSMC Confirms JASM Safe; TEL Halts Plants as Chip Supply Chain Assesses Impact

A powerful earthquake in Japan's Kumamoto Prefecture has raised concerns over potential disruptions to the country's semiconductor supply chain. According to UDN News, TSMC said structural inspections confirmed no damage affecting the safety of buildings at its JASM fab in Kumamoto, and the facility...

2026-07-29

[News] SK hynix Posts Record 2Q Results but Misses Estimates Reportedly Due to Conservative Pricing; Completes 10 LTAs

SK hynix posted another record quarter, with second-quarter revenue surging 257% YoY to 79.32 trillion won (US$54.55 billion) and operating profit jumping 557% to 60.54 trillion won. However, both figures fell short of analysts’ estimates of 84 trillion won and 64 trillion won, respectively, accor...

2026-07-29

[News] Chinese Advanced Packaging Firms Kicks-Start a New Round of Capacity Expansion

China is witnessing a fresh wave of investment in advanced semiconductor packaging, with a series of expansion projects targeting AI computing, automotive-grade chips, and next-generation memory technologies. According to incomplete statistics, nearly ten major advanced packaging projects have be...

2026-07-29

[News] China’s Semiconductor Sector Attracts Billions in Industrial Investment Funds

A new wave of industrial capital is moving into the China’s semiconductor sector, as local governments and industry leaders accelerate investments in strategic technologies. Recently, Shenzhen, Shanghai and Wuhan have unveiled a series of major industrial fund initiatives and registration updat...

2026-07-28

[News] China’s Lens, BOE Advance Glass Substrates as Taiwan’s Supply Chain Prepares for TSMC’s CoPoS

Competition in glass substrate-based advanced packaging is intensifying across the semiconductor industry. According to Central News Agency, China is accelerating investment in glass substrate-based advanced packaging, while Taiwan is stepping up efforts to strengthen its competitiveness by integra...

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