While TSMC has yet to deploy High-NA EUV for advanced-node commercialization, the foundry giant today laid out a clear roadmap for the technology, targeting high-volume manufacturing starting in 2030, according to its press release. Notably, the move comes as ASML also expands its collaboration w...

Huawei is emerging as a key force in China’s push to localize semiconductor equipment. According to Financial Times, the company is backing domestic firms developing critical components for advanced chipmaking equipment as Beijing seeks to reduce reliance on foreign technology. One major effort re...

Samsung is stepping up its silicon photonics development by bringing key testing capabilities in-house. According to The Elec, sources say Samsung is testing silicon photonics photonic integrated circuit (PIC) wafers using probe stations from U.S.-based FormFactor and Taiwan-based MPI, with plans to...

China’s leading DRAM maker CXMT has officially announced mass production of LPDDR6, with the next-generation memory making its commercial debut in Xiaomi’s newly launched Xiaomi 18 Fold flagship foldable. According to CXMT, based on internal testing, its LPDDR6 delivers up to 60% higher peak ban...

On September 4, Starksemi Semiconductor(Wuhan) Co., Ltd. announced the completion of a new funding round exceeding CNY 1 billion. The investment was led by CATL's Puquan Capital, with participation from Meituan Longzhu, Guotai Haitong, Youshan Capital, CDH Hong Kong, and state-owned investment platf...