[News] SK hynix Reportedly Eyed as Potential Partner to Operate Intel’s Ohio Fab After Denying Acquisition Plans

While both Intel and SK hynix denied market chatters that the latter could work towards acquiring Team Blue’s Ohio fab, the two parties could still be exploring collaboration opportunities. Semafor, citing sources familiar with the matter, reports that SK hynix is among the potential partners being considered to help operate the facility, rather than take full ownership.

As reported by Barron’s earlier, in a regulatory filing with the Korea Exchange on Wednesday, SK hynix reiterated that it “has not pursued or decided to acquire Intel’s Ohio site,” while adding that it continues to review a range of investment and acquisition opportunities.

Discussions remain at an early stage, though. According to Semafor, Intel is seeking a partner to help advance its long-delayed Ohio semiconductor project, but the two companies have yet to begin formal negotiations over a potential operating arrangement. Another source close to Intel described SK hynix’s interest as preliminary.

Notably, Economy Tribune suggests that Intel has prior experience using external capital while retaining fab ownership and operational control. In 2022, the company partnered with Brookfield on a Semiconductor Co-Investment Program (SCIP), jointly investing up to US$30 billion in its Arizona Ocotillo campus, with Intel holding a 51% stake and Brookfield 49%, the report adds.

Intel-SK hynix Ties Could Extend Beyond Ohio Fab Talks

Economy Tribune also highlights potential collaboration opportunities between Intel and SK hynix, noting that the two companies could explore initiatives similar to SK hynix’s HBM and advanced packaging partnership with TSMC.

The report adds that SK hynix is testing the integration of its HBM with Intel’s EMIB-based 2.5D packaging technology, evaluating its potential to combine memory and system semiconductors. As AI demand drives the need for advanced packaging capacity, Green Economy News reports that Samsung and Micron are also assessing EMIB’s compatibility and power efficiency, reflecting memory makers’ broader push toward diversified packaging solutions amid the tight supply of TSMC’s CoWoS.

Push for U.S. Semiconductor Manufacturing

The potential collaboration comes as U.S. President Donald Trump continues to urge foreign chipmakers, led by South Korea’s Samsung and SK hynix, to increase investment and semiconductor production in the country. Prior to Semafor’s report, JoongAng Ilbo reported on July 22 that SK hynix was in talks with Intel over a possible acquisition of the Ohio semiconductor campus, with the goal of starting memory chip production in the U.S. within five years.

Both Samsung Electronics and SKhynix are aggressively expanding their manufacturing presence in the U.S., yet neither company currently produces memory chips on American soil. Samsung’s Taylor plant, featuring 2nm node and has secured orders from Tesla’s AI5 and AI6 chips, is expected to enter mass production in 2027.

Meanwhile, SK hynix is investing nearly US$4 billion in a new advanced packaging facility in West Lafayette, Indiana, dedicated to HBM production. According to Korea Herald Business, the company has officially broken ground on the site, with full-scale operations scheduled to begin in the second half of 2028.

Intel’s Delayed Ohio Fab Remains a Strategic Asset

Despite years of delays, Intel’s Ohio project remains a key pillar of the U.S. semiconductor manufacturing strategy. The company broke ground on the site in 2022 with plans to invest US$28 billion, but after missing its original 2025 opening target and announcing major layoffs, Intel pushed back the launch of its first new fab in four decades to 2030, according to Semafor.

While Intel has begun mass production of its 18A process at Arizona’s Fab 52, Ohio is expected to play a critical role in supporting the company’s next-generation manufacturing roadmap. Tom’s Hardware notes that the campus is designed to support Intel’s 14A and future nodes, with room for up to eight fabs.

Read more

• [News] Intel’s Ohio 14A Project Gains Traction as Key Contractor Bechtel Reportedly Ramps Hiring
• [News] Intel’s Ohio Plant Dilemma: Build at High Cost — or Pay Back Billions in Government Aid

(Photo credit: Intel)