Backed by Japan’s push for semiconductor revival, Rapidus is positioning itself as a challenger to TSMC’s reign — but can it deliver? According to Commercial Times, citing a recent interview by Shupure News with industry commentator Jyo Poyo, who frequently publishes in outlets such as Tokyo ...

A widening rift between Nexperia’s China and Netherlands operations is stirring concern across the global auto industry. According to Bits&Chips, sources say the European arm of Nexperia is accelerating efforts to expand its assembly and testing capacity outside China. The company’s Malaysia...

Beyond its September reveal of a multi-year Ascend AI chip roadmap through 2028—complete with proprietary HBM development—Huawei is making equally aggressive moves in enterprise storage. At its Huawei Connect Europe event in Madrid, the tech giant rolled out a sweeping refresh of its storage por...

At the SK AI Summit 2025, SK hynix revealed a bold roadmap outlining its memory plans beyond 2029. According to Wccftech, the roadmap spans two phases: one for 2026 to 2028, and another for 2029 to 2031. Across both periods, the company plans to roll out a full lineup of HBM, DRAM, and NAND products...

Shortly after announcing its “AI Megafactory” partnership with NVIDIA, where over 50,000 Team Green’s GPUs will drive chip production, Samsung is reportedly racing to clear NVIDIA’s HBM4 qualification. According to DealSite, the South Korean memory giant aims for final certification in early...