TSMC is broadening its advanced packaging outsourcing. According to ETNews, sources say the company has decided to expand outsourcing of CoW (Chip-on-Wafer), a key step in its CoWoS packaging technology for AI chips, to OSAT companies including ASE. Unlike its previous practice of primarily outsourc...

According to TrendForce’s latest memory spot price trend report, DRAM spot price momentum has weakened from late July, with 4Gb DDR4 and 2Gb DDR3 prices edging higher amid limited transactions. In NAND flash, price rebound momentum remains subdued without strong buying demand, although spot prices...

China’s leading etching equipment maker, Advanced Micro-Fabrication Equipment (AMEC), could emerge as an unexpected beneficiary of tightening U.S. export controls. According to Reuters, Samsung Electronics and SK hynix are evaluating AMEC’s semiconductor equipment for potential use at their Chin...

Samsung presented its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. According to inews24, the company introduced next-generation high-bandwidth memory (HBM) technologies, including zHBM and HBM5, together with its 400+ layer V10 BV-NAND (V-NAND) ...

As Qualcomm's planned chip price hikes from September 1 begin to take shape, supply chain sources cited by TechNews say the company is negotiating final pricing with customers, with premium flagship chips expected to see the steepest increases of 10%–15% amid soaring costs. According to TechNew...