Samsung Electronics is reportedly reshaping its back-end operations in Cheonan as rising HBM demand drives a shift in packaging capacity. According to Sisa Journal, sources say the company plans to gradually phase out Exynos mobile application processor (AP) packaging at the site and convert the rel...

As the AI boom strains supplies across the tech industry, Intel is sounding the alarm over mounting component bottlenecks. Speaking at Splunk’s .conf26 Global Broadcast, CEO Lip-Bu Tan said memory constraints could further intensify, with prices soaring five- to sevenfold already, according to SeD...

Samsung Electro-Mechanics is expanding its push into AI advanced packaging through organic bridge technology. According to The Elec, sources say Samsung Electro-Mechanics and Qualcomm have been jointly developing organic bridge technology for 2.1D packaging for more than a year. The companies are cu...

Hanmi Semiconductor has reportedly entered the supply chain of Terafab, Elon Musk’s massive AI semiconductor project in Texas. According to Hankyung, sources say the company recently signed a purchase order (PO) with Terafab for packaging equipment used in AI system semiconductors. The equipment i...

The 2nm smartphone chip race is heating up. MediaTek today unveiled its next-generation flagship Dimensity 9600 Pro, built on TSMC’s 2nm process. According to TaiSounds, the chipmaker’s entry into Google’s TPU supply chain has added to its pricing clout, with the chip reportedly commanding up ...