Global tech giants are accelerating their investments in glass-based advanced packaging. Intel recently entered a strategic partnership with Lens Technology to address bottlenecks of advanced packaging using TGV (Through Glass Via) technology, while BOE announced its full-scale entry into the AI sem...

With memory champions CXMT and YMTC tapping capital markets, investment strategies of their key backer, China’s National Integrated Circuit Industry Investment Fund (the “Big Fund”), are once again in the spotlight. According to ijiwei, however, the Big Fund’s Phase III, launched in 2024,...

Elon Musk's semiconductor ambitions are beginning to take shape as new details of the Terafab project emerge. According to Reuters and Houston Chronicle, the first phase will require an initial investment of $16.8 billion, well below the company's earlier $55 billion estimate. However, a May regulat...

Samsung Electronics' System LSI division may no longer remain the sole supplier of display driver ICs (DDIs) for the Galaxy S series. According to ZDNet, citing industry sources, Samsung is considering a dual-source DDI supply chain for some Galaxy S27 models and the Galaxy S28 Ultra. DDIs are chips...

Demand for advanced glass materials used in AI semiconductor packaging remains robust. According to Nikkei, Nittobo on Aug. 5 raised its consolidated net profit forecast for the fiscal year ending March 2027 to JPY 20 billion, up JPY 3 billion from its previous guidance, though still down 52% from t...