Rising AI computing power demand continues to drive the market for 12-inch silicon wafers, combined with capacity expansions across HBM, 3D NAND, and advanced logic nodes, opening a crucial window of opportunity for domestic large silicon wafer manufacturers. Since early 2026, major Chinese playe...

Elon Musk’s Terafab plans may include a new approach to EUV light generation. According to Bits and Chips, the facility may adopt free-electron lasers (FELs) instead of the laser-produced plasma (LPP) sources currently used by ASML. Responding to a post on X, Tesla CEO Elon Musk wrote “FEL, FTW�...

Samsung is advancing its next-generation lithography roadmap. According to ZDNet, the company is targeting its 1nm process, expected to enter mass production around 2030, for the adoption of High-Numerical Aperture (High-NA) EUV. Citing ChangMin Park, a Master and senior technology expert at Samsung...

Amid surging demand for advanced packaging, TSMC Vice President of Advanced Packaging Technology and Services Jun He highlighted the company’s latest CoWoS advances at the 2026 OCP APAC Summit today. According to TechNews and the Economic Daily News, TSMC’s 5.5-reticle-size CoWoS is now in volum...

Apple’s upcoming iPhone roadmap is facing growing pressure from both rising costs and production challenges. The iPhone 18 Pro and iPhone 18 Pro Max may see price hikes, while according to Wccftech, industry analysts suggest poor production yields may have forced Apple to scrap the all-glass desig...