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2025-07-22

[News] SK hynix’s HBM4 Lead Shrinks as Rivals Close Gap Ahead of 2026 Shakeup

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

2025-07-22

[News] Apple Reportedly to Debut Foldable in 2026, Prompting Korean Component Makers to Expand

As Samsung and Apple lead the push into foldable smartphones, South Korean component suppliers are reportedly increasing their facility investments, according to ZDNet. The report indicates that the market is expected to grow substantially from 2026 onward, prompting these suppliers to scale up capa...

2025-07-22

[News] TSMC’s Q2 AI Revenue Reportedly Exceeds USD 10B, with Share Expected to Reach Nearly 50%

According to a report from Economic Daily News, TSMC recently announced that its Q2 revenue reached USD 30.07 billion, setting a new record high. Notably, the report highlights that, as indicated by institutional investors, AI-related business accounted for more than one-third of the quarterly total...

2025-07-22

[News] BT Substrate, Fiberglass Prices Reportedly Eye 20% Hike amid AI Boom and Supply Shortage

With TSMC and NVIDIA signaling booming AI demand, the supply chain is heating up and key materials are facing imminent price hikes. According to Commercial Times, BT substrate prices have been climbing since July, and prices for high-end fiberglass fabrics used in IC substrates are also set to rise ...

2025-07-22

[News] World’s First Electron–Photon–Quantum Integrated Chip System Unveiled

A team from Boston University, the University of California, Berkeley, and Northwestern University has jointly developed the world’s first electron–photon–quantum integrated chip system, as reported in the latest issue of Nature Electronics. This is the first time that a quantum light source a...

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