While SanDisk is speeding up the development of High Bandwidth Flash (HBF), a next-generation architecture that vertically stacks NAND, the company is also advancing additional memory concepts aimed at addressing structural capacity constraints. According to a U.S. patent (US 12,430,274 B2) filed...

While China remains far from accessing ASML’s most advanced lithography systems, it is steadily strengthening its position in domestically used semiconductor tools. According to Nikkei, Japan is already feeling the impact, with its top five chipmaking equipment manufacturers posting a 10% decline ...

As TSMC ramps up 2nm and 3nm production, it is also accelerating the phaseout of legacy nodes. Commercial Times, citing supply chain sources, reports that monthly wafer starts at Fab 15A, TSMC’s primary 28nm site, have dropped by more than 25% since the start of the year. The pullback in 28nm p...

Innoscience announced on June 19 that the Munich Regional Court has just issued a pair of rulings, from which it could be confirmed that Innoscience’s currently marketed gallium nitride (“GaN”) power device products fall outside the scope of Infineon’s asserted German patents and may be comm...

As Micron prepares to report its fiscal third-quarter results on June 24, investor attention is turning to whether its strong earnings and elevated margins can be sustained, and how long the ongoing memory rally can support its growth story in DRAM and HBM. Here are four key areas to watch in the up...