According to TrendForce’s latest memory spot price trend report, in terms of DRAM, mainstream DDR4 chips largely traded sideways, while DDR3 spot prices continued to rise, partly supported by tight DDR4 availability and higher costs, which have prompted some consumer DRAM buyers to downgrade speci...

TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties have announced a 10-year agreement to enhance advanced packaging capabilities in Arizona and support further investment in the U.S. semi...

Apple is expected to use TSMC's 2nm for its A20 and A20 Pro chips, but industry discussions are already shifting to the A22 Pro and a potential move to 1.4nm. According to Bloomberg, Apple is expected to adopt a 1.4nm process for the A22 Pro, which is slated for high-end iPhone models in 2028. Whil...

Amid ongoing speculation that Apple could emerge as an early customer for Intel’s 18A-P process for future M-series chips, Intel appears to be taking another step toward that possibility. At the VLSI Symposium in Honolulu on Tuesday, the company confirmed that 18A-P has entered risk production, ac...

As demand grows for glass substrates driven by their superior heat resistance and lower warpage in advanced semiconductor packaging, equipment and materials suppliers are accelerating development efforts. Against this backdrop, Japan’s Nikon showcased its light-responsive surface treatment agent �...