According to TrendForce's latest memory spot price trend report, regarding DRAM, momentum in both DDR4 and DDR5 remains weak, as end-user demand continues to struggle with elevated price levels, while 2Q26 contract pricing has yet to be formally announced. Meanwhile, in terms of NAND, module houses ...

Please note that this article cites information from Commercial Times and Next Apple. As NVIDIA’s Rubin moves into mass production, industry attention is already shifting to the specifications of its next-generation Rubin Ultra. While market rumors suggest that Team Green may integrate four GPU ...

Please note that this article cites information from Commercial Times, The Elec and TSMC. As GPU designs evolve toward denser chip-to-chip connectivity and faster data rates, optical transmission is taking on a bigger role. Foundry giants are also moving in, with TSMC’s COUPE silicon photonics p...

Please note that this article cites information from Chosun Ilbo, Newsis, News Tomato, and The Elec. JEDEC is reportedly considering relaxing standards governing next-generation HBM. According to Chosun Ilbo, sources indicate that JEDEC (Joint Electron Device Engineering Council) is weighing a ...

Please note that this article cites information from Aju News, Money Today Broadcasting, Hankyung and SK hynix. As memory giants race to bet on post-HBM technologies like HBF (High Bandwidth Flash), the man who is widely credited as the "father of HBM" is making a bold call. KAIST professor Joungh...