Subject


IC Manufacturing, Package&Test


2025-05-06

[News] New Taiwan Dollar Rises Rapidly, Pressuring TSMC and MediaTek Margins

IC Manufacturing, Package&Test

According to a report from TechNews, the recent sharp appreciation of the New Taiwan dollar (NTD) has sparked market concerns over potential foreign exchange losses—especially for export-driven sectors like semiconductors, represented by companies such as TSMC. The report notes that on May 2, t...

2025-05-06

[News] Chinese Chipmakers Ramp Up R&D Spending in 2024 — SMIC Tops the List with RMB 5.45B

IC Manufacturing, Package&Test

R&D and innovation drive semiconductor growth, with chip giants like TSMC leading the charge. Notably, according to ijiwei, Chinese semiconductor companies are actively increasing their R&D investments as well. In 2024, a total of 221 A-share listed Chinese semiconductor companies recorded ...

2025-05-05

[News] Chip Tariff Window Closes Wednesday Amid Quiet Pushback, Sparking Steep Rate Fears

IC Manufacturing, Package&Test

As the public comment window for the U.S. Section 232 semiconductor probe closes this Wednesday (May 7), the chip industry is holding its breath over whether tariffs are coming—and how steep they’ll be. However, as responses have been usually quiet, concerns have been sparked on the lack of push...

2025-05-05

[News] Huawei Reportedly Builds 7nm AI Chip Line in First Shot at Making Its Own High-End Chips

IC Manufacturing, Package&Test

As the U.S. tightens export controls on NVIDIA’s H20 chips, Huawei is stepping up with a broader ambition in semiconductors. According to the Financial Times, the company is swiftly building an advanced chip production line in Shenzhen to manufacture 7nm smartphone and Ascend AI processors, implyi...

2025-05-02

[News] Wafer-Level Packaging Showdown: TSMC Scales up CoWoS Reticle Size, as Intel Readies Foveros-S

IC Manufacturing, Package&Test

Following its North America Technology Symposium, TSMC has shared fresh details on its CoWoS (Chip on Wafer on Substrate with silicon interposer) roadmap. According to Tom’s Hardware, Kevin Zhang, TSMC’s Senior Vice President and deputy COO, confirmed how companies like Cerebras and Tesla (with ...

  • Page 53
  • 161 page(s)
  • 802 result(s)

Get in touch with us