On the 24th, Qualcomm unveiled its next-generation chips at the annual Snapdragon Summit. According to ZDNet, citing Alex Katouzian, Qualcomm Senior Vice President and Head of the Mobile, Compute & XR (MCX) Business Unit, the company has been working with Samsung on the chip design for the Galax...

According to ETNews, sources say SK hynix intends to add about 20 EUV systems by 2027. The company reportedly has around 20 units, including some used for R&D, and the planned expansion could double that number within two years. With each system costing hundreds of billions of KRW, the total inv...

Huawei has recently disclosed two patents related to silicon carbide (SiC) thermal management technologies: “Thermal Conductive Composition and Its Preparation Method and Application” and “A Thermal Conductive and Wave-Absorbing Composition and Its Application.” The first patent outlines ...

As TSMC’s 2nm mass production countdown begins, speculation mounts over its major clients. KLA, a key chipmaking equipment supplier, reports that around 15 customers are designing at the N2 node, including roughly 10 high-performance computing (HPC) players, according to Investing.com, etnews and ...

According to Tom’s Hardware, citing Cosmos, Johns Hopkins University researchers have proposed “beyond-EUV (B-EUV),” a step beyond today’s industry-standard EUV lithography. The method employs 6.5–6.7nm soft X-ray lasers, which the report notes could enable resolutions down to 5nm and belo...