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IC Manufacturing, Package&Test


2025-07-25

[News] Intel Earnings Call Highlights: 18A Lifecycle, Product Roadmap, and AI & ASIC Strategies

IC Manufacturing, Package&Test

At its July 24 earnings call, Intel warned that failure of 14A could jeopardize its advanced node business. But CEO Lip-Bu Tan and his team were also candid, sharing key updates on the product roadmap and Intel’s outlook on the growing AI market. Here’s a brief summary of Intel’s conference ca...

2025-07-25

[News] Intel Earnings Call Bombshell: Could Exit Advanced Nodes if 14A Fails, Eyes TSMC Outsourcing Beyond 18A

IC Manufacturing, Package&Test

After shocking the market with mass layoffs in mid-July, Intel delivered another bombshell during its latest earnings call. In a 10-Q filing cited by Reuters, the company warned that without major external foundry customers for its 14A process, it may be forced to abandon next-gen advanced nodes ent...

2025-07-24

[News] Tsinghua University Breaks Ground on EUV Photoresist in China’s Semiconductor Push

IC Manufacturing, Package&Test

As SiCarrier advances chipmaking tools for 5nm production amid China’s semiconductor self-reliance push, Tsinghua University has reportedly achieved a breakthrough in EUV lithography materials. Researchers have developed a new polytellurium oxane-based photoresist, opening up fresh design strategi...

2025-07-21

[News] NVIDIA’s H20 Production Faces Challenges? Inventory Reportedly Holds Amid Full TSMC N4 Capacity

IC Manufacturing, Package&Test

With U.S. approval to restart H20 sales in China, buzz around NVIDIA’s inventory is ramping up. Reuters, citing The Information, reports the AI chip giant has told Chinese clients that H20 supplies are running low, while TSMC has already shifted its reserved production lines—making restocking a ...

2025-07-21

[News] Nikon Unveils DSP-100 System for Panel-Level Packaging, Supporting 600mm Panels with 9x Throughput

IC Manufacturing, Package&Test

As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...

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