As part of its global cost-cutting drive, Intel is pulling back on new fab plans in Germany and Poland —and its long-delayed Ohio project has now been pushed beyond 2030-31, with no clear timeline in sight. So, what’s next for the Ohio site? According to The Columbus Dispatch and NBC4i, Intel no...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...

With U.S. approval to restart H20 sales in China, buzz around NVIDIA’s inventory is ramping up. Fueled by strong demand from Chinese buyers, the AI chip giant reportedly placed a 300,000-chip order with TSMC last week, Reuters reports. According to sources cited by the report, the new TSMC orde...

TSMC is accelerating its U.S. push, with its third Arizona fab (F21 P3) reportedly breaking ground in Q2. Still, the foundry giant is playing catch-up—Treasury Secretary Scott Bessent revealed TSMC’s Arizona site currently meets just 7% of U.S. chip demand, according to Wccftech via The The All-...

After grappling with 2nm yield challenges and failing to lock in major clients, Samsung is making a bold comeback. According to Digital Daily and Reuters, the company has announced a massive foundry deal worth over 22.7 trillion won (nearly $17 billion)—a potential game-changer for its chip busine...