As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, K.C. Hsu, Vice President of Integrat...

Supported by SoftBank’s $2 billion investment and the U.S. government’s 10% ownership stake, Intel has provided a more detailed outlook on its foundry business and key process node roadmap. According to Bloomberg and Investing.com, Team Blue views 2026 as a pivotal year for its manufacturing tec...

As per foreign media reports, Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to implement large-scale price adjustments over the coming years—a move expected to significantly impact chip production costs for major clients like Apple and NVIDIA. The driving forces behind this pricin...

As Huawei debuted the second-generation trifold smartphone, the Mate XTs, on September 4, the spotlight turned to the company’s bold return to high-end silicon. According to Huawei Central, mydrivers and The Paper, Huawei Consumer Business Group Chairman Richard Yu officially confirmed at the laun...