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IC Manufacturing, Package&Test


2025-08-20

[News] U.S. Reportedly Mulls Stakes in CHIPS Act Recipients after Intel, Raising Risks for TSMC, Samsung

IC Manufacturing, Package&Test

While U.S. Commerce Secretary Howard Lutnick confirmed in a CNBC interview that the administration is pursuing a 10% stake in Intel, Washington is considering going further. According to Reuters, Lutnick is exploring a plan to take equity stakes in other CHIPS Act recipients—such as TSMC, Samsung,...

2025-08-20

[News] Chip Equipment Makers Ride AI Boom but Face 5% Q2 Revenue Decline on China Slowdown

IC Manufacturing, Package&Test

According to Nikkei, earnings among leading chipmaking equipment makers are beginning to diverge, shaped by weakening sales in China and rising demand for AI chips. The report highlights that the combined net profit of the top ten chipmaking equipment makers remained robust, rising about 40% to $...

2025-08-19

[News] Intel Gets Twin Lifelines: SoftBank’s $2B Backing and Potential 10% Stake from U.S. Government

IC Manufacturing, Package&Test

After CEO Lip-Bu Tan met with President Donald Trump last week, Intel seems to be getting some breathing air amid struggles, as the chipmaker scored a $2 billion boost from SoftBank, which bought shares at $23 each, just below Intel’s $23.66 close, CNBC reports. Meanwhile, the company could als...

2025-08-18

[News] Hua Hong Seeks Controlling Stake in HLMC in Major China Foundry Consolidation Push

IC Manufacturing, Package&Test

China’s No. 2 foundry, Hua Hong Semiconductor, is reportedly moving to acquire a controlling stake in Shanghai Huali Microelectronics (HLMC) via a combination of share issuance and cash, along with a supporting capital raise, according to ijiwei and Security Times. The deal, aiming to resolve t...

2025-08-18

[News] NVIDIA Reportedly Eyes Small-Scale HBM Base Die Production in 2027: Rattling Memory, Chip Markets

IC Manufacturing, Package&Test

Market rumors suggest NVIDIA has kicked off development of its own HBM base die, sending ripples through the supply chain as it could reshape the next-generation HBM landscape. According to the Commercial Times, the chip is expected to be built on the 3nm node, with small-batch trial production sche...

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