Subject


IC Manufacturing, Package&Test


2025-09-22

[News] TSMC 2nm Customer Surge: 15 Clients Reportedly Secured, 10 in HPC

IC Manufacturing, Package&Test

As TSMC’s 2nm mass production countdown begins, speculation mounts over its major clients. KLA, a key chipmaking equipment supplier, reports that around 15 customers are designing at the N2 node, including roughly 10 high-performance computing (HPC) players, according to Investing.com, etnews and ...

2025-09-22

[News] Researchers Propose “Beyond EUV” Using Soft X-Rays, Potentially Challenging High-NA EUV

IC Manufacturing, Package&Test

According to Tom’s Hardware, citing Cosmos, Johns Hopkins University researchers have proposed “beyond-EUV (B-EUV),” a step beyond today’s industry-standard EUV lithography. The method employs 6.5–6.7nm soft X-ray lasers, which the report notes could enable resolutions down to 5nm and belo...

2025-09-19

[News] STMicroelectronics Joins Panel-Level Packaging Race with New French Pilot Line, Launching 3Q 2026

IC Manufacturing, Package&Test

As leading foundries and packaging giants such as TSMC and ASE ramp up panel-level packaging (PLP) capacity, STMicroelectronics has emerged as an unexpected contender. The company announced it will establish a new pilot line at its Tours site in France to advance next-generation PLP technology, with...

2025-09-19

[News] Mega NVIDIA-Intel Deal: No Chipmaking Orders, Co-Developed Products Might Launch 2027–28

IC Manufacturing, Package&Test

NVIDIA on Thursday stunned markets with a $5 billion investment in Intel and the announcement of a joint effort to develop chips for PCs and data centers—a striking vote of confidence in the struggling U.S. chipmaker, coming just weeks after Washington took a historic 10% federal stake. In additio...

2025-09-19

[News] India’s Chip Push Grows as ARM Unveils Design Office for Advanced Chips, Including 2nm

IC Manufacturing, Package&Test

India’s chip ambitions continue to take shape. Following the launch of the country’s first 3nm design center led by Renesas, ARM’s newly inaugurated Bengaluru office is reported to kick off India’s advanced 2nm chip design, according to BISinfotech and IANSlive. On September 16, Union Min...

  • Page 17
  • 156 page(s)
  • 778 result(s)

Get in touch with us