Subject


IC Manufacturing, Package&Test


2025-09-30

[News] Applied Materials and GlobalFoundries Achieved Strategic Collaboration

IC Manufacturing, Package&Test

Applied Materials, Inc. has announced a strategic collaboration with GlobalFoundries (GF) to establish a state-of-the-art waveguide manufacturing facility at GF’s Singapore plant, aiming to accelerate the next wave of innovation in photonics technology. Leveraging decades of semiconductor exper...

2025-09-26

[News] U.S. Reportedly Weighs 1:1 Rule on Domestic vs. Imported Chips, Favoring TSMC, GF and Micron

IC Manufacturing, Package&Test

After a wave of tech giants pledged additional U.S. investments during President Trump’s new term to sidestep high chip tariffs, Washington is reportedly considering another policy. According to The Wall Street Journal, companies that fail to maintain a 1:1 ratio of domestic production to imports ...

2025-09-26

[News] Qualcomm Launches Snapdragon 8 Elite Gen 5, May Plan Samsung Galaxy-Exclusive Version

IC Manufacturing, Package&Test

On the 24th, Qualcomm unveiled its next-generation chips at the annual Snapdragon Summit. According to ZDNet, citing Alex Katouzian, Qualcomm Senior Vice President and Head of the Mobile, Compute & XR (MCX) Business Unit, the company has been working with Samsung on the chip design for the Galax...

2025-09-25

[News] SK hynix Reportedly Doubling EUV Fleet by 2027, Potentially Set to Rank Third Globally

IC Manufacturing, Package&Test

According to ETNews, sources say SK hynix intends to add about 20 EUV systems by 2027. The company reportedly has around 20 units, including some used for R&D, and the planned expansion could double that number within two years. With each system costing hundreds of billions of KRW, the total inv...

2025-09-24

[News] Huawei Released SiC Thermal Management Technology Patents

IC Manufacturing, Package&Test

Huawei has recently disclosed two patents related to silicon carbide (SiC) thermal management technologies: “Thermal Conductive Composition and Its Preparation Method and Application” and “A Thermal Conductive and Wave-Absorbing Composition and Its Application.” The first patent outlines ...

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