Shortly after touring SK hynix’s COMPUTEX booth in Taipei alongside NVIDIA CEO Jensen Huang on June 2, SK Group Chairman Chey Tae-won met with TSMC Chairman C.C. Wei for the first time in two years, according to a post by SK hynix on its official X account on June 4. Hankyung adds that the meeting...

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, DDR4 and DDR5 spot prices continued to rise, with both segments posting notable gains. However, buyers remained cautious amid higher supplier quotes. In the NAND flash segment, spot quotations would continue to slum...

As next-gen HBM solutions has become a key focus at COMPUTEX amid surging AI demand, SK Group Chairman Chey Tae-won made a brief visit to the SK hynix booth on June 2 and spoke with the media. According to TechNews, Chey expects supply-demand tightness in the memory market to persist through 2030. ...

Shortly after Samsung announced HBM4E sample shipment starts, the memory giant has made another progress by showcasing a mock-up of its 8th-generation High Bandwidth Memory (HBM5) for the first time, at Computex 2026 in Taipei on June 2, according to Chosun Biz and Mirror Media. As highlighted by...

Just months after rolling out HBM4 shipments in early 2026, Samsung has begun providing samples of the industry’s first 12-layer HBM4E to major global partners, according to the company’s latest press release. Given that HBM4 shares the same 1c DRAM process and 4nm base die architecture as HB...