With Samsung’s major strike scheduled to begin on May 21, the memory giant has already moved to implement pre-emptive measures to limit potential losses. According to The Financial News and Newspim, the company is curbing the intake of new wafers into production lines while reshaping its product m...

Samsung Electronics is reportedly developing a next-generation HBM packaging technology aimed at bringing high-performance on-device AI to mobile devices. According to ETNews, sources say the company is working on a “Multi Stacked FOWLP” technology that combines ultra-high-aspect-ratio copper pi...

Microsoft is continuing to deepen its custom chip push, with SK hynix expected to play an increasingly important role in the effort. According to The Korea Herald, sources say SK hynix CEO Kwak Noh-Jung is set to meet Microsoft co-founder Bill Gates and CEO Satya Nadella this week at the closed-door...

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, overall trading conditions improve following holidays in certain regions, with demand concentrated on DRAM suppliers’ DDR4 512x16 and 1Gx16 chips. In the NAND flash segment, the spot market carries on from last we...

As the market focuses on China’s push into HBM and next-gen NAND, another domestic memory player is quietly advancing in DDR5 amid the AI-driven demand surge. According to IT Home and Security Times, module maker POWEV said its 64GB 5600MT/s DDR5 Registered DIMM (RDIMM) server module, launched ear...