DeepSeek V4 is already running on Huawei’s Ascend 950 AI computing platform, as Huawei’s AI chip roadmap appears to be accelerating. According to Mydrivers, Huawei Vice President and President of Huawei Cloud China Chen Lin said Huawei plans to deploy the next-generation Ascend 950DT on Huawei C...

Following confirmation that the “big three” memory makers—Samsung Electronics, SK hynix, and Micron—have secured HBM4 supply approval for NVIDIA’s Vera Rubin, NVIDIA and SK hynix further deepened their collaboration. As highlighted by Global Economic News, SK hynix’s high-performance mem...

Amid intensifying competition from Chinese players, Onsemi is reportedly under mounting pressure, with up to 300 job cuts planned at its Rožnov pod Radhoštěm plant in the Czech Republic, according to local media outlet e15. The move follows an earlier round of layoffs in 2025, when the US-based S...

Back-end semiconductor equipment suppliers are increasingly focusing on High Bandwidth Flash (HBF), a next-generation memory technology designed for AI inference. According to ZDNet, industry sources said that South Korean and international back-end equipment makers have begun developing thermal com...

SK hynix is reportedly preparing a major DRAM capacity expansion. According to The Elec, the company has shared plans with key suppliers to nearly double its DRAM wafer production capacity by 2030–2031 from current levels. The plan aligns with comments made by SK Group Chairman Chey Tae-won at Co...