Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plans to build an advanced packaging plant in Gwangju. Samsung Electronics is expected to announce the investment as early as the end of this month at a mee...

As Washington continues to tighten restrictions on AI chip exports to China and related entities, its allies are also considering similar steps. According to Bloomberg, Taiwan is weighing significantly stricter controls on AI chip shipments to China in a move to further align with US measures. Th...

While China continues efforts to produce advanced chips without access to ASML’s EUV tools, it is also pushing to reduce reliance on DUV systems. According to the South China Morning Post, Chinese start-up Prinano claims it has validated mass production of photonic chips on 8-inch silicon wafers u...

Following Jensen Huang’s push for higher HBM supply from SK hynix, the memory maker has taken another step to ramp up production. According to ET News, SK hynix has placed a 44.2 billion won order with Hanmi Semiconductor for TC (thermal compression) bonders used in sixth-generation HBM (HBM4) pro...

Following Jensen Huang's high-profile meetings with SK hynix during his South Korea visit, Samsung Electronics Vice Chairman Jun Young-hyun met with the NVIDIA CEO on June 8 to discuss potential cooperation in HBM and foundry services. According to The Chosun Daily, Jun said the discussions focused ...