Please note that this article cites information from Commercial Times, Tom’s Hardware, and Economic Daily News. Tesla CEO Elon Musk has unveiled the Terafab mega-fab vision, aiming to integrate logic, memory, and advanced packaging, raising questions about potential pressure on foundry leader T...

Please note that this article cites information from South China Morning Post, IT Home, Mydrivers, and 163.com. After outlining a three-year AI chip roadmap last September, Huawei has now rolled out its first product under the plan. According to South China Morning Post and IT Home, the company�...

Please note that this article cites information from The Elec. Rumors have recently resurfaced that lithography leader ASML is evaluating entry into the back-end semiconductor equipment market, targeting the fast-growing advanced packaging segment. According to Korean media outlet The Elec, ASML ha...

Please note that this article cites information from The Elec, Investing.com, News 1, Alphabiz, and EBN. After Micron stunned the market with soaring margins—projected to reach 81% in 3QFY26, up from a record 75% in the previous quarter—the industry is keen to understand the drivers behind. On...

Please note that this article cites information from EBN News,  ZDNet, Micron, and News Tomato. Memory giants are reportedly moving toward multi-year supply agreements to enhance stability, with potential deal structures and prospective customers beginning to take shape. According to EBN News, i...